U.S. Patents by Florian Schattenmann
| US-20070284758-A1 | Electronics package and associated method |
| US-20060147719-A1 | Curable composition, underfill, and method |
| US-20050181214-A1 | Curable epoxy compositions, methods and articles made therefrom |
| US-20050148721-A1 | Thin bond-line silicone adhesive composition and method for preparing the same |
| US-20050048291-A1 | Nano-filled composite materials with exceptionally high glass transition temperature |
| US-20050049350-A1 | Thin bond-line silicone adhesive composition and method for preparing the same |
| US-6667411-B2 | Method for making organooxysilanes |
| US-6489501-B2 | Method and apparatus for forming a carbon-silicon bond in a silane |
| US-20020161254-A1 | METHOD AND APPARATUS FOR FORMING A CARBON-SILICON BOND IN A SILANE |
| US-6455721-B1 | Method for making organyltriorganooxysilanes |
| US-6420585-B1 | Method for making triorganooxysilanes |
| US-6384258-B1 | Method for making organylorganooxysilanes |
| US-20010047102-A1 | Method for making organooxysilanes |
| US-6288257-B1 | Method for making tetraorganooxysilanes |
| US-6258971-B1 | Method for making organooxysilanes |